Please use this identifier to cite or link to this item:
https://hdl.handle.net/2440/137076
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DC Field | Value | Language |
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dc.contributor.author | Shehata, M. | - |
dc.contributor.author | Wang, K. | - |
dc.contributor.author | Withayachumnankul, W. | - |
dc.date.issued | 2022 | - |
dc.identifier.citation | International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2022, vol.2022-August, pp.1-2 | - |
dc.identifier.isbn | 9781728194271 | - |
dc.identifier.issn | 2162-2027 | - |
dc.identifier.issn | 2162-2035 | - |
dc.identifier.uri | https://hdl.handle.net/2440/137076 | - |
dc.description.abstract | We experimentally demonstrate the transmission of a carrierless quadrature amplitude-modulated signals at a data rate up to 64 Gbit/s using a 253 GHz photonics-based terahertz communications system with optical intensity modulation, 10-km single mode liber transmission and terahertz envelope detection. | - |
dc.description.statementofresponsibility | Mohamed Shehata, Ke Wang, and Withawat Withayachumnankul | - |
dc.language.iso | en | - |
dc.publisher | IEEE | - |
dc.relation.ispartofseries | International Conference on Infrared Millimeter and Terahertz Waves | - |
dc.rights | ©2022 IEEE | - |
dc.source.uri | https://ieeexplore.ieee.org/xpl/conhome/9895463/proceeding | - |
dc.subject | carrierless amplitude and phase (CAP) modulation; terahertz communications; terahertz pulse shaping | - |
dc.title | Carrierless I-Q Mixing for Terahertz Communications | - |
dc.type | Conference paper | - |
dc.contributor.conference | 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) (28 Aug 2022 - 2 Sep 2022 : Delft, The Netherlands) | - |
dc.identifier.doi | 10.1109/IRMMW-THz50927.2022.9895872 | - |
dc.publisher.place | Online | - |
dc.relation.grant | http://purl.org/au-research/grants/arc/DP180103561 | - |
pubs.publication-status | Published | - |
dc.identifier.orcid | Shehata, M. [0000-0001-6887-5741] | - |
dc.identifier.orcid | Withayachumnankul, W. [0000-0003-1155-567X] | - |
Appears in Collections: | Electrical and Electronic Engineering publications |
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