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Please use this identifier to cite or link to this item: https://hdl.handle.net/2440/76414
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dc.contributor.authorLi, J.-
dc.contributor.authorShah, C.-
dc.contributor.authorWithayachumnankul, W.-
dc.contributor.authorUng, B.-
dc.contributor.authorSriram, S.-
dc.contributor.authorBhaskaran, M.-
dc.contributor.authorChang, S.-
dc.contributor.authorAbbott, D.-
dc.date.issued2012-
dc.identifier.citationProceedings of the 37th International Conference on Infrared, Millimeter and Terahertz Waves, IRMMW-THz 2012.-
dc.identifier.isbn9781467315975-
dc.identifier.issn2162-2027-
dc.identifier.issn2162-2035-
dc.identifier.urihttp://hdl.handle.net/2440/76414-
dc.descriptionExtent: 2p.-
dc.description.abstractWe present two designs of planar terahertz metamaterials for strain sensing. A series of resonance frequency shifts are obtained with differing gap widths when the sensor is under mechanical compression. The subwavelength metamaterial structures exhibit a high-Q resonance resulting in a good sensitivity to mechanical deformation. Because of the penetrability and relatively high spatial resolution of terahertz waves, the proposed metamaterial-based sensors can be embedded in materials for structural sensing.-
dc.description.statementofresponsibilityJining Li, Charan M. Shah, Withawat Withayachumnankul, Benjamin S. Y. Ung, Sharath Sriram, Madhu Bhaskaran, Shengjiang Chang and Derek Abbott-
dc.language.isoen-
dc.publisherIEEE-
dc.relation.ispartofseriesInternational Conference on Infrared Millimeter and Terahertz Waves-
dc.rights©2012 IEEE-
dc.source.urihttp://dx.doi.org/10.1109/irmmw-thz.2012.6380222-
dc.titlePlanar terahertz metamaterials for strain sensing-
dc.typeConference paper-
dc.contributor.conferenceInternational Conference on Infrared, Millimeter and Terahertz Waves (37th : 2012 : Wollongong, Australia)-
dc.identifier.doi10.1109/IRMMW-THz.2012.6380222-
dc.publisher.placeUSA-
pubs.publication-statusPublished-
dc.identifier.orcidWithayachumnankul, W. [0000-0003-1155-567X]-
dc.identifier.orcidAbbott, D. [0000-0002-0945-2674]-
Appears in Collections:Aurora harvest 4
Electrical and Electronic Engineering publications

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